- SOI Wafer
- 실리콘 웨이퍼는 가장 흔한 Wafer로써, 집적회로, 검출기/센서장치, MEMS 제조 등
첨단산업의 다양성에 널리 사용되고 있습니다.
SOI Wafer Application
| High-speed ICs | High-temperature ICs |
| Low-power ICs | Low-voltage ICs |
| Microwave components | Power device |
| MEMS | Semiconductor |
Product Specification
| Method | Fusion bonding |
| Diameter | Ø 1" / Ø 2" / Ø 3" / Ø 4"/ Ø 6" |
| Thickness | 275 um ~ 775 um |
| Orientation | <100> / <111> / <110> or others |
| Conductivity | P - type / N - type / intrinsic |
| Dopant | Boron / Phosphorous / Antimony / Arsenic |
| Resistivity | 0.001 ~ 10000 ohm-cm |
| Surface | One side polished / two sides polished |
| TTV | <= 10 um |
| Bow / Warp | <= 40 um |
| Grade | Prime / Test / Dummy grade |